Friday, February 11, 2011

Wafer? FA? Packaging? IC Layout?

sorry guys sbb lme gler x update...
bknnye ape la kn...
i used to be a busy person recently...
internet unimap n my bband are likely
as faster as snails...hee..
skrg nie nk cte ttg micro-e...
da msuk sem 4 da nie...
byk bnde kne blaja...
sume sbjct core pdat ngn theory..(baca n fhm)
so nie ade la antara gmbr2 yg dpt aku
capture mnggunekn due jnis microscope
Olympus High Power n Low Power Microscope...

 nie ade la dlm IC...
nk tnjukkn gmbr die yg brsmbung ngn frame...

 nie ade la frame...
bntuk mcm kacang...hehe...
tp dpggl wedge...
method used to connect
die & frame is ball-to-wedge...
wire used : Gold..
 nie ade la metallization dlm IC...

 image of resistor...
klu korg nk tau yg mne resistor..
yg mnjalar mcm ular tu...

yg focus image tu...
transistor nmenye...
x ingt la plak gne MOSFET, FET or BJT..hehe..
yg ptg, ianye ade la transistor..

***For more information, MOSFET = Metal Oxide Semiconductor Field Effect Transistor, FET = Field Effect Transistor, BJT = Bipolar Junction Transistor...

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